Average salary: Rs164,250 /yearly

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Search Results: 6,240 vacancies

 ...CAREER IN FILM MAKING - MARATHI Do you have passion for Film Making Opportunities at different levels are available based on the candidate abilities and experience. The basic requirement is, you must establish and showcase your passion for films. You should have strong... 

Ramoji Academy of Movies

Secunderabad
23 days ago
 ...learn, communicate and advance faster than ever. JR47889 Wafer & Die Bonding Modeling and Simulation - Sr. Engineer As a wafer and...  ...data science techniques and the application to our industry will make Micron more impactful and relevant. Key aspects of this role will... 

Micron

Secunderabad
8 days ago
 ...the IP or SoC with consideration for overall product costs such as die size optimization, die per reticle/good die per wafer maximization...  ...across client, enterprise and data center. Our mission is to make zeta-scale computing accessible to every human on the planet by the... 

Intel

Secunderabad
8 days ago
 ...innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in...  ...ESD current density and resistance verification tool to ensure full die layout meet all ESD design rule requirements. Lead and coordinate... 

Micron

Secunderabad
8 days ago
 ...equipment s. Manage and control the proper up keeping of wax Dies and Patterns. Co-ordinate with QC Deptt for the Inspection of...  ...The Key Performance Indicators (KPIs) for this role shall be: Making the Shells as per the schedules. Maintenance and adherence to... 

RPG Communications Holdings

Secunderabad
a month ago
 ...Partner with Process Integration, yield engineering to improve overall die yield and meet the critical milestones planned for the testchip...  ...: Excellent data analysis, problem solving, and decision-making skills. Strong foundation of mixed-signal VLSI such as analog circuits... 

Micron

Secunderabad
8 days ago

Rs 4 - 5 lakhs p.a.

 ...Acknowledgement of production optimization to the CAM department/team leader Qualification and Experience Diploma in Tool & Die making – 4 years. Minimum 3 years practical experience milling and lathe machines. CNC milling machines,INTEGREX CNC Turning machine... 

RECEX Pvt. Ltd.

Secunderabad
more than 2 months ago
 ...focus on innovation across sensing, illumination and visualization to make journeys safer, medical diagnoses more accurate and daily moments...  ...level concerns, including: packaging, parasitics, power, die size, cost, etc. 'Power User' level knowledge of SPICE/Spectre... 

ams OSRAM

Secunderabad
a month ago

Rs 7 - 8 lakhs p.a.

 ...Customer/ Internal Team.. forecast to Mould Base/Hot Runner / Steel RM suppliers. Education/Experience: Diploma in Tool and Die making or Mechanical Engineer Very Good Communication skill.( Verbal & E-Mails) Experience with 3D modeling software. Proficiency... 

RECEX Pvt. Ltd.

Secunderabad
more than 2 months ago
 ...related experience in software design and development A never say die attitude and willingness to learn, explore and take on new...  ...associated with unsolicited resumes 'When applying for a job, please make sure to only open emails that you will receive during your... 

NCR Voyix

Secunderabad
23 days ago
 ...Collaborate with Process Integration, yield engineering to improve overall die yield and meet the critical milestones planned for the testchip....  .... ~ Excellent data analysis, problem solving, and decision-making skills ~ Knowledge of Flash memory architecture and operation... 

Micron

Secunderabad
8 days ago
 ...leadership and communication skills Ability to think strategically and make data-driven decisions Strong project management and...  ...Casting division Suitable candidate should have experience with Die Design, Die Ordering, Methoding & New Product Development. Candidate... 

Desire Consultancy Services

Secunderabad
24 days ago
 ...semiconductor packaging processes and materials and technology and trends such as PCB design and manufacturing, molding, wire-bonding, die attach, etc. A good understanding of semiconductor package and SSD system reliability and defects solder-joint reliability, warpage,... 

Micron

Secunderabad
8 days ago
Description Manager-CAM Skill Master CAM, MILLING, DIE, 3D , MODELLING, CAD Qualification

Genius Consultants Ltd

Hyderabad
26 days ago
 ...ability to optimize interrelations between physical design of the die and package design. ~ Hands on experience of doing and optimizing...  ...design team and tool and IP vendors. What's in it for you? Make a difference : you will have the opportunity to join a well-... 
Remote job

Edgecortix Inc.

Hyderabad
27 days ago
 ...• Should have minimum 3 Years hand on experience in NX & AutoCAD Software. • Should have Thorough knowledge in all types of moulds, Die casting dies, Jigs and Fixtures. • Thorough knowledge on available standards and how to use them. • Thorough Knowledge on Hot Runner... 

Mangal Industries

Hyderabad
18 days ago
 ...communication between NAND Design Rule and other key stakeholders Enthusiastically identify and address process issues and process window vs. die size conflicts stemming from specific database layout or layout techniques Assure timely documentation and feedback of R&D... 

Micron

Secunderabad
8 days ago
 ...intuitive development tools, unmatched ecosystem and robust support make us the ideal long-term partner in building advanced industrial,...  ...design, specification and fighting guides. Input would be tear-down at die level and various spec analysis. Driving whole portfolio of... 

Silicon Labs

Secunderabad
19 days ago
 ...semiconductor packaging processes and materials and technology and trends such as PCB design and manufacturing, molding, wire-bonding, die attach, etc. A good understanding of semiconductor package and SSD system reliability and defects solder-joint reliability, warpage,... 

Micron

Secunderabad
8 days ago
 ...Flash design team at Micron Technology, Inc., you will contribute to the development of memory products that are best-in-class in terms of die size, performance, reliability, and power. Take part in multi-functional key features evaluation. By understanding design... 

Micron

Secunderabad
8 days ago