IC Package Process Engineer

IC Package Process Engineer

Start Date

Starts  Immediately

CTC (ANNUAL)

Competitive salary Competitive salary

Experience

2 year(s)

2 year(s)

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Not Provided

Posted 1 day ago

Job

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About the job

About AXIRO

Axiro Semiconductor is a fabless semiconductor design company headquartered in Bengaluru, driving innovation in RF, wireless infrastructure, satellite communication (Satcom), and high-speed connectivity solutions. Backed by CG Power & Industrial Solutions Ltd. part of the 120-year-old Murugappa Group. Axiro represents Indias leap into the global semiconductor arena. With millions of chips already powering global networks, a world-class team across India, the US, and Europe, and cutting-edge expertise spanning RF, mmWave, GaN, and next-generation communication technologies, Axiro is engineering the future of how the world connects, computes, and communicates.

For more details

Role Overview

The IC Package Process engineer will contribute to the development and optimization of advanced semiconductor packaging technologies. This role offers an opportunity to work closely with Package Design, Manufacturing, Supply Chain, Quality, and OSAT partners to support new product introduction (NPI), process standardization, and continuous improvement initiatives.

Key Responsibilities

• Collaborate with Packaging, Design, Manufacturing, Supply Chain, and Quality teams to support package development activities.
• Assist in assembly process development and optimization for QFN, FCCSP, FCBGA, and module-based packages.
• Support OSAT partners in new product introduction (NPI), process qualification, and manufacturing readiness activities.
• Analyze process performance data to identify opportunities for yield improvement and defect reduction.
• Participate in failure analysis, root cause investigations, and corrective action implementation for quality and reliability issues.
• Support process characterization, validation, and standardization efforts across package assembly operations.
• Prepare technical reports, presentations, and engineering documentation to communicate project progress and results.
• Contribute to continuous improvement initiatives focused on manufacturing efficiency, process robustness, and product quality.

Required Qualifications

• 2 to 5 years of experience in semiconductor packaging operations at an assembly site, either in India or internationally.
• Diploma or Bachelor's or Masters degree in Electronics Engineering, Electrical Engineering, Materials Science, Semiconductor Technology, Applied Physics, or a related field.
• Strong understanding of semiconductor devices, wafer fabrication processes, assembly operations, and packaging technologies.
• Demonstrated ability in data analysis, problem-solving, root cause investigation, and process optimization.
• Strong analytical thinking, data interpretation, and presentation skills.
• Proficiency in Microsoft Excel and PowerPoint for data analysis, reporting, and presentations.

Desired Attributes

• Strong analytical thinking and structured problem-solving approach.
• Effective communication and presentation skills.
• Ability to collaborate in a cross-functional and fast-paced engineering environment.
• Eagerness to learn and adapt to new technologies and challenges.
• Passion for semiconductor devices, packaging technologies, and manufacturing excellence.
• Exposure to new product introduction (NPI) and process qualification activities.

Additional Information

Preferred CGPA: 7.0/10 or above

Location: Bengaluru, India

Job type: Full time

Notice Period: Immediate

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Who can apply

Only those candidates can apply who:

1. have minimum 2 years of experience

Salary

Probation:

Duration:

Salary during probation:

After probation:

Annual CTC: Competitive salary

Number of openings

1

Editor’s note

Information above is Internshala's interpretation and paraphrasing of what we found on the shared link.

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